Veltrixa Veltrixa

OEM/ODM AI GPU Hosting Factory & Suppliers

Custom-Engineered High-Density AI Server Compute Nodes, Liquid-Cooling Platforms, and Rack-Scale Architecture for Global Hyperscale Cloud Deployments

The AI GPU Hosting Paradigm Shift

The rapid expansion of Large Language Models (LLMs) like DeepSeek, GPT-4, and specialized generative AI systems has fundamentally changed modern data center infrastructure. Standard high-performance CPU architectures are no longer sufficient. High-density GPU heterogeneous computing has transitioned from an advanced engineering choice to a core business necessity.

Custom OEM/ODM AI GPU Hosting bridges the gap between raw hardware manufacturing and application-specific server deployments. Globally operating hyperscalers, local cloud service providers (CSPs), and research centers require hardware platforms tailored to specific interconnect topologies (such as NVIDIA NVLink, NVSwitch, and PCIe Gen 5.0 systems) to eliminate data bottlenecks and maintain compute efficiency.

At Shenzhen Veltrixa Intelligent Computing Co., Ltd., we design high-efficiency, multi-GPU computing environments. We address key design factors including thermal dissipation capacity (TDP exceeding 700W–1000W per GPU node), high-throughput network configurations (such as 400G InfiniBand and RoCE v2), and robust power distribution unit (PDU) systems to ensure sustained processing capacity.

AI GPU Hosting Production Line

Shenzhen Veltrixa Intelligent Computing Co., Ltd.

A trusted partner in custom AI compute infrastructure, combining advanced R&D depth with modern manufacturing facilities.

2017
Established
12+
Years Industry Exp.
86
R&D Engineers
$18M
Annual Export Revenue
1,280+
Supply Chain Partners

Advanced OEM/ODM R&D and Manufacturing Capabilities

Located in Shenzhen, China, Veltrixa operates a modern production facility designed for assembling, testing, and verifying complex, high-density server equipment. Our core services address the dynamic requirements of hyperscale cloud environments, deep learning centers, and enterprise edge computing environments.

  • Flexible Customization: Full OEM/ODM services, private labeling, hardware configuration adjustment, and full-rack integration options.
  • Engineering Depth: Independent R&D with 86 engineers focusing on PCB design, BMC/BIOS custom configurations, and thermal simulation.
  • Rapid Product Development: Released 124 new hardware products last year to support evolving GPU, CPU, and storage technologies.
  • Comprehensive Supply Chain: Powered by a network of over 1,280 certified suppliers, ensuring component availability even during supply constraints.
Veltrixa Hardware Customization Center

Key Industry Trends Driving GPU Hardware Development

Deploying AI training and inference models requires changes to standard server chassis designs, power architectures, and thermal management systems.

1. Direct Liquid Cooling (DLC) Integration

As single GPU accelerators approach TDPs of 700W to 1000W+, standard air cooling is no longer efficient. The industry is rapidly adopting closed-loop direct liquid cooling and liquid-to-air hybrid cooling options. We design server blocks with specialized cold plates, manifold integrations, and dry-break leak protection systems.

2. High-Speed Interconnect Topologies

Scaling AI compute requires high-speed connections between accelerator cards. Our designs feature optimized PCIe Gen 5.0 PCB layouts and support high-density mezzanine connectors (SXM5 and OAM modules). This maximizes NVLink/NVSwitch and Infinity Fabric bandwidth for parallel model training.

3. Rack-Scale and Cluster Provisioning

Enterprise procurement has shifted from single-server nodes to complete integrated racks. Providing rack-scale systems requires integrated power distribution (such as busbar configurations), network cabling (InfiniBand/RoCE), and pre-validated software layers to allow plug-and-play installation in data centers.

Enterprise Hardware Architectures for Diverse AI Workloads

Providing optimized, deployment-ready hardware solutions tailored to specific workloads, data compliance requirements, and scale targets.

AI Server Enclosure Assembly

1. LLM Training Clusters (SXM5 & OAM Solutions)

For training large language models, we provide custom 4U/8U GPU server nodes designed for SXM5 or OAM accelerator platforms. Our systems feature dual Intel Xeon Scalable or AMD EPYC processors, 8x accelerator bays, PCIe Gen 5 routing, and up to 8x high-speed NIC bays. This helps ensure low-latency communication during distributed deep learning workflows.

  • Supports redundant 3000W+ Platinum power supply units (N+N configuration).
  • Optimized BIOS profiles for reduced communication jitter across nodes.
  • Fully validated with containerized frameworks (PyTorch, TensorFlow, Kubernetes).
Deep Learning Inference Rack Systems

2. High-Density AI Inference & DeepSeek Deployments

Inference workloads require high storage throughput, low processing latency, and flexible PCIe expansion card choices. Our 2U/4U rack server layouts support multiple PCIe GPU cards (like NVIDIA L40S, L4, or AMD Instinct systems). These layouts are optimized for deep learning models, retrieval-augmented generation (RAG), and cloud-hosted vector search engines.

  • Supports NVMe drive bays with high IOPS performance to eliminate data loading delays.
  • Smart cooling fan controls adjusted for server thermal zones.
  • Custom chassis options for edge deployment where rack depth is limited.
Server Thermal and Signal Testing

3. Edge AI Nodes & Specialized Rugged Systems

For processing AI data closer to the source—such as in smart manufacturing, regional telecom offices, or remote branch locations—we design edge compute servers. These systems feature shallow-depth chassis, dust filtration, and robust vibration protection, maintaining performance in non-traditional server room environments.

  • Extended operating temperature range configurations (-5°C to 55°C).
  • Flexible input voltage modules (support for -48V DC telecom power inputs).
  • Remote out-of-band management options via Redfish/IPMI.

Rigorous Quality Assurance & Compliance Standards

Reliable computing hardware is essential. Veltrixa implements detailed quality control protocols at every stage of the manufacturing process.

100% Pre-Shipment Inspection

Every server that leaves our facility undergoes a complete diagnostic process. This includes functional testing, component stress testing, thermal chamber validation, and peripheral compatibility checks.

Burn-In & Stress Protocols

We run full-load stress tests (utilizing specialized CUDA and deep learning testing suites) for up to 72 hours. This process helps identify potential infant mortality failures in electronic components before final shipping.

46 Quality Control Professionals

Our dedicated quality assurance team monitors each step of production—from incoming component inspection (IQC) to in-process line inspections (IPQC) and final outgoing quality checks (OQA).

Our export operations cover key markets in North America, Western Europe, Southeast Asia, the Middle East, and Australia. Veltrixa designs products that meet regulatory standards including FCC, CE, RoHS, and CCC. This helps simplify the integration of our hardware systems into global enterprise data centers.

Technical Roadmap & Future Outlook

Aligning custom hardware development with the next generation of computing architectures, memory standards, and sustainable system designs.

Embracing PCIe Gen 6.0 and CXL Architectures

As computing requirements grow, our R&D roadmap focuses on integrating PCIe Gen 6.0 system buses. This interface doubles the bandwidth of PCIe 5.0, enabling faster interconnect speeds. Additionally, we are developing Compute Express Link (CXL) memory expander platforms to allow dynamic memory sharing between host CPUs and GPU accelerators, helping optimize resource utilization across complex workloads.

Liquid-to-Liquid Immersion Systems

For next-generation data centers targeting low power usage effectiveness (PUE) scores, we are testing single-phase and two-phase direct immersion cooling chassis. These systems submerge server nodes in specialized dielectric fluids, eliminating standard heat sinks and fans. This approach can reduce cooling energy usage by up to 90% while allowing denser server clustering.

Modular Hardware Specifications (OCP Compliant)

We support open standards by incorporating design patterns from the Open Compute Project (OCP). Our future server platforms utilize the Open Accelerator Module (OAM) standard and standardized DC-SCM management boards. This modular approach helps reduce vendor lock-in and simplifies hardware maintenance cycles for large-scale deployments.

Current Engineering Development Phases

  • Phase 1: PCIe 6.0 Signal Integrity Checks (Currently in signal simulation and layout testing phases).
  • Phase 2: Multi-GPU Immersion Testing (Conducting lifetime fluid compatibility tests with major coolant manufacturers).
  • Phase 3: DeepSeek-focused Microcode Optimization (Collaborating with software partners to adjust BMC telemetry for real-time model serving).

Production Facility & Engineering Gallery

A look inside our manufacturing processes, testing chambers, and hardware customization bays in Shenzhen.

Technical Q&A / FAQ

Find answers to common technical queries regarding our OEM/ODM custom server capabilities, design options, and deployment processes.

Q1: What GPU types and accelerator form factors do you support?
We build and configure platforms for a wide range of hardware form factors. This includes PCIe-based accelerators (such as the NVIDIA H100 PCIe, L40S, L4, and AMD Instinct cards) as well as high-density mezzanine setups (including SXM5 and OAM modules). Our server chassis are custom-designed with specific power delivery and airflow lanes to handle the thermal loads of each card type.
Q2: How does Veltrixa handle server cooling for high-power-density setups?
We use a mix of thermal solutions based on the target rack configuration. For standard air-cooled data centers, we use high-RPM, hot-swappable fan banks paired with custom-engineered counter-rotating fan ducts to maintain airflow. For high-density systems (where GPU TDP exceeds 500W–700W), we design and integrate direct liquid cooling (DLC) cold plates that connect directly to facility water loops or local liquid-to-air cooling distribution units (CDUs).
Q3: Can we customize the system BIOS, BMC firmware, and styling?
Yes. Our R&D team provides full firmware customization services. We can modify BIOS settings for specific workload profiles, change boot screens, and customize BMC interfaces to match your organization's remote management standards. Additionally, we offer custom chassis styling, including custom colors, silk-screened logos, and customized front bezels.
Q4: What is your standard production cycle and quality inspection process?
For custom OEM/ODM builds, the production cycle typically ranges from 4 to 8 weeks, depending on component availability and customization complexity. Every server undergoes our multi-step quality assurance protocol. This process includes component verification, functional checks, high-temperature burn-in testing, and network throughput validation. We provide full test documentation for each completed unit.